서일전자 주식회사

제조능력

MANUFACTURING CAPACITY

제조능력

LAYERS 1L ~ 16L
Finished Board
Thickness		 0.2T ~ 3.2T
Via Diameter Min. 0.25 Φ
Line/Space 80 / 80 ㎛
Internal Layer
Copper Foil Thickness		 12㎛~105㎛
External Conductor
Thickness		 18㎛~105㎛
Finished Surface
Treatment
  • OSP
  • ENIG
  • HASL
  • Lead free HASL

* 추가 특수사항은 상호 협의 후 진행